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MULTI-CHIP MODULES WITH CAVITIES


Description: 4 to 12 layers
Base Material: Multifunctional FR4, Teflon. BT
Min. Board Thickness : 14.0 mil
Min. Line/Spacing : 3/3 mil
Min. Hole Size : 8.0 mil
Surface Finish : Full Gold
Features: 2 step Cavity

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Company Gultech (Suzhou) Electronics

Address

80, Su Hong Xi Road, Suzhou Industrial Park Suzhou 215021, Jiangsu Province,,
Jiangsu,China
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Phone +86-512-6767 1711
Fax +86-512-6761 0023
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