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pcb
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Items Mass Production Sample
Max.Layer Count 8Layers 10Layers
Max.Panel Size 21"x24" 21"x26"
Max.Board Thickness 3.2mm 5.8mm
Min.Trace Width/Spacing
Outer Layer 3.5/3.5mils 3/3mils
Inner Layer 3.5/3.5mils 3/3mils
Min.Board Thickness 2L:12mils 2L:12mils
4L:16mils 4L:14mils
6L:32mils 6L:24mils
Min.SMT/BGA Pitch 12mils for SMT 12mils for SMT
24mils for BGA 20mils for BGA
Min.Drill Size&Aspect Ratio 0.2mm Drill for 0.8mm 0.2mm Drill for 0.8mm
Thickness(4.0:1) Thickness(4.0:1)
0.25mm Drill for 1.6mm 0.25mm Drill for 1.6mm
Thickness(6.4:1) Thickness(8.0:1)
0.30mm Drill for 2.4mm 0.30mm Drill for 2.4mm
Thickness(8.0:1) Thickness(9.6:1)
Surface Finishes HASL,Entek HASL,Entek Cu 19,
immersion and Electrolytic Gold immersion and Electrolytic Gold
Selective Selective
immersion Gold immersion Gold
Plus OSP Plus OSP
Controlled Impedance +/- 10% +/-7%
Contouring Routing,V-Groove, Routing,V-Groove,
Beveling punsh Beveling punsh
Hol Dlameter +/- 2 mil +/- 2 mil
Min.S/M Thickness 0.4 mil 0.6 mil
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